Diamond Wire Wafer Slicer from China
A multi-wire diamond saw that uses fixed abrasive technology to slice multiple wafers from silicon boules simultaneously. This slicing machine is designed for hard semiconductor materials, which are similar to hard plastics or hard rubber, and thus falls under this tariff item.
Duty Rate — China → Canada
PGA flags (2)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be requiredHCConsumer Products SafetyMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090. Logic: MATCH IF (Valid HS Code).
- HC
Consumer Products Safety · May be required · on some HTS numbers under this code
May require HC Consumer Products Safety depending on intended use (HC21) and Canadian product category (HC29, HC30, HC31, HC32, HC33, HC34, HC35, HC36, HC37); or intended use (HC22, HC23, HC24, HC26, HC27) and Canadian product category (HC37), and on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090; Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090. Logic: MATCH IF (Valid HS Code) AND (Intended Use Code) AND (Valid Canadian Product Category).
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the machine's principal function is slicing, not grinding or polishing, to ensure classification under this item
• Keep records of the machine's specifications for CBSA verification
• Check if the machine is eligible for duty-free treatment under the Information Technology Agreement