SiC Wafer Grinder from Japan
A SiC wafer grinder grinds silicon carbide (SiC) power semiconductor wafers, handling the extreme hardness of ceramic-like material. It processes ceramics or minerals for semiconductor use, fitting tariff item 8464.90.00 for machine-tools for working stone, ceramics or similar mineral materials.
Duty Rate — Japan → Canada
0%
Import Tips
• The CBSA may reclassify this under heading 84.86 if it is solely for semiconductor manufacture; provide evidence of the grinding function
• Verify if the grinder qualifies for duty relief under the Machinery Remission Program
• Keep records of the machine's specifications and intended use to support the classification