Diamond Wafer Lapper from China

A diamond wafer lapper uses diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. It processes hard, brittle mineral-like materials, which falls under tariff item 8464.90.00 for machine-tools for working stone, ceramics or similar mineral materials.

Duty Rate — China → Canada

PGA flags (1)Show detailsECCCVehicles and Engine Emissions ProgramMay be required

ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8464900010; Equal To 8464900090. Logic: MATCH IF (Valid HS Code).

CBSA Single Window matching criteria, unknown

Calculate with your customs value Verify with the Tariff Assistant

Import Tips

• Confirm the lapper is not classified under heading 84.86 if it is solely for semiconductor wafer manufacture; the CBSA may require a ruling

• Keep documentation on the lapping process and materials to support the mineral-working classification

• Consider whether the machine qualifies for duty-free entry under a free trade agreement