Silicon Wafer Lapping Machine from Germany
This is a lapping machine for silicon wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication. It works on silicon, a mineral material, and is used in wafer preparation. It is classified here as a grinding or polishing machine for mineral materials.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the machine is not classified as semiconductor manufacturing equipment under heading 84.86
• Provide evidence that the lapping is for wafer preparation, not for other processes
• Check if the machine qualifies for any duty relief programs