Silicon Wafer Lapping Machine from China
This is a lapping machine for silicon wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication. It works on silicon, a mineral material, and is used in wafer preparation. It is classified here as a grinding or polishing machine for mineral materials.
Duty Rate — China → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8464200010; Equal To 8464200090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the machine is not classified as semiconductor manufacturing equipment under heading 84.86
• Provide evidence that the lapping is for wafer preparation, not for other processes
• Check if the machine qualifies for any duty relief programs