Silicon Carbide Wafer Lapper from China
This is a lapping machine for silicon carbide (SiC) wafers used in power semiconductors. It achieves sub-micron flatness for epitaxial growth, working on SiC, a ceramic mineral material. It is classified here as a grinding or polishing machine for mineral materials.
Duty Rate — China → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8464200010; Equal To 8464200090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Verify that the lapping process is considered grinding or polishing under the tariff
• Provide documentation on the machine's function to avoid classification as semiconductor equipment
• Check if the machine requires any safety certifications for import