Quartz Wafer Lapping Machine from Japan
A double-sided lapping machine used to achieve precise flatness tolerances on quartz crystal wafers used in electronic oscillators. It grinds both sides of the wafer simultaneously using abrasive slurry to produce a highly flat and parallel surface. This machine is classified under tariff item 8464.20.00 as a grinding machine for working stone.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the machine's abrasive slurry handling system complies with Canadian environmental regulations
• Provide a detailed description of the machine's precision capabilities to the CBSA for classification
• Check if the machine requires any Canadian safety certifications for semiconductor manufacturing equipment