Used Wafer Edge Grinder from Japan
A rebuilt grinder for profiling wafer edges post-slicing to prevent chipping during handling, achieving mirror-finished edges. It works on cermets without removing material, and as a used tool for cermet working, it falls under tariff item 8463.90.00 for other machine-tools for working metal or cermets without removing material.
Duty Rate — Japan → Canada
0%
Import Tips
• Keep records of the rebuild and the machine's use in semiconductor wafer preparation
• Ensure the grinding process is described as working without material removal
• Verify if any end-use certificates are needed for semiconductor manufacturing equipment