Rebuilt Wafer Back Grinder from Germany
A used grinder for thinning wafer backsides to target thickness for device processing, achieving total thickness variation (TTV) of less than 1 micron. It works on cermets without removing material, and as a rebuilt machine-tool, it falls under tariff item 8463.90.00 for other machine-tools for working metal or cermets without removing material.
Duty Rate — Germany → Canada
0%
Import Tips
• Provide evidence of the rebuild and the machine's specifications, including TTV performance
• Confirm that the grinding process is classified as working without material removal
• Check if the grinder qualifies for any duty relief programs for semiconductor equipment