Rebuilt Silicon Wafer Lapper from China
A used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. It works on cermets without removing material, and as a rebuilt machine-tool, it falls under tariff item 8463.90.00 for other machine-tools for working metal or cermets without removing material.
Duty Rate — China → Canada
0%
Import Tips
• Document the rebuild and the machine's use in semiconductor wafer preparation
• Ensure the lapping process is described as working without material removal to support classification
• Verify if any end-use certificates are needed for semiconductor manufacturing equipment