Used Disco DFG-7340 Wafer Slicing Saw from Germany
A rebuilt numerically controlled saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off of metal/cermet material. It operates by cutting-off metal or cermets, classifying it under tariff item 8461.90.10 for numerically controlled sawing machines.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the machine is declared as numerically controlled and used for sawing operations
• Verify if the machine qualifies for duty relief under the Machinery Remission Program
• Provide technical specifications to the CBSA to support the classification