Rebuilt Wafer Edge Profiling Machine from Japan
A numerically controlled machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. It works on metal or cermets, falling under tariff item 8461.90.10 for numerically controlled machine-tools for shaping or other metal removal.
Duty Rate — Japan → Canada
0%
Import Tips
• Document the machine's numerical control and profiling functions for customs clearance
• Verify if the machine is eligible for duty-free import under trade agreements
• Provide a detailed description of the machine's operations to avoid misclassification