Rebuilt Okamoto ACC-3224DX Wafer Grinder from United States
A numerically controlled grinder, rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. It operates by removing metal or cermets, classifying it under tariff item 8461.90.10 for numerically controlled machine-tools.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the machine is declared as numerically controlled and used for grinding operations
• Verify if the machine qualifies for duty relief under the Machinery Remission Program
• Provide technical specifications to the CBSA to support the classification