Okamoto ACC-3224DXNC Wafer Planing Machine from Germany
A numerically controlled planing machine optimized for flattening semiconductor crystal ingots to precise diameters before grinding and slicing into wafers. It removes metal or cermets, falling under tariff item 8461.90.10 for numerically controlled planing machines.
Duty Rate — Germany → Canada
0%
Import Tips
• Provide evidence of the machine's numerical control and planing function to the CBSA
• Verify if the machine qualifies for duty relief under the Machinery Remission Program
• Ensure all safety and technical documentation is available for inspection