ZAX Wafer Edge Profiling Saw from Mexico
A numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. It is essential for semiconductor wafer preparation and qualifies as a numerically controlled sawing machine.
Duty Rate — Mexico → Canada
0%
Import Tips
• Document the numerical control system for CBSA
• Provide details on the edge profiling function to support classification
• Keep records of the machine's use in semiconductor preparation