ZAX Wafer Edge Profiling Saw from Germany
A numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. It is essential for semiconductor wafer preparation and qualifies as a numerically controlled sawing machine.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Document the numerical control system for CBSA
• Provide details on the edge profiling function to support classification
• Keep records of the machine's use in semiconductor preparation