Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from United States
A CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. It removes metal or cermet via an abrasive wheel and is classified as a numerically controlled sawing machine.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the CNC controls are documented for CBSA
• Provide the machine's technical specifications to confirm its sawing function
• Consult with a customs broker for any end-use requirements