Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Japan
A CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. It removes metal or cermet via an abrasive wheel and is classified as a numerically controlled sawing machine.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the CNC controls are documented for CBSA
• Provide the machine's technical specifications to confirm its sawing function
• Consult with a customs broker for any end-use requirements