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8461.50.10/Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System/Japan

Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Japan

A CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. It removes metal or cermet via an abrasive wheel and is classified as a numerically controlled sawing machine.

Duty Rate — Japan → Canada

0%
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Import Tips

• Ensure the CNC controls are documented for CBSA

• Provide the machine's technical specifications to confirm its sawing function

• Consult with a customs broker for any end-use requirements

Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Japan — Import Duty Rate | Tariff item 8461.50.10