Sylatronix STX 220 Wafer Dicing Saw from Japan
A numerically controlled gang saw for simultaneous cutting-off of multiple semiconductor wafer lanes. It is designed for high-volume cermet material removal in device singulation and qualifies as a numerically controlled sawing machine.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Document the numerical control system for CBSA
• Provide details on the machine's multi-lane sawing capability to support classification
• Check if any permits are needed for semiconductor manufacturing equipment