Sylatronix STX 220 Wafer Dicing Saw from China
A numerically controlled gang saw for simultaneous cutting-off of multiple semiconductor wafer lanes. It is designed for high-volume cermet material removal in device singulation and qualifies as a numerically controlled sawing machine.
Duty Rate — China → Canada
0%
Import Tips
• Document the numerical control system for CBSA
• Provide details on the machine's multi-lane sawing capability to support classification
• Check if any permits are needed for semiconductor manufacturing equipment