Logitech WA/20 Wafer Slicing Machine from Japan
A numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. It is specifically used for crystal growers' output and is a numerically controlled sawing machine for cutting-off cermet materials.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the numerical control features are clearly documented for CBSA
• Verify the machine's use in semiconductor boule slicing to support classification
• Keep maintenance records to prove the machine's condition for import