Logitech WA/20 Wafer Slicing Machine from Germany
A numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. It is specifically used for crystal growers' output and is a numerically controlled sawing machine for cutting-off cermet materials.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the numerical control features are clearly documented for CBSA
• Verify the machine's use in semiconductor boule slicing to support classification
• Keep maintenance records to prove the machine's condition for import