Loadpoint Micro ACE Stealth Dicing Machine from Germany
The Loadpoint Micro ACE Stealth Dicing Machine is an ultra-precise numerically controlled saw that uses stealth laser-induced cutting-off for stress-free separation of semiconductor wafers. Although material removal occurs via internal fracture, the machine is structured as an NC sawing machine, which qualifies it under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
Duty Rate — Germany → Canada
Import Tips
• Ensure the machine is declared as numerically controlled and used for cutting-off or sawing of semiconductor wafers to match the tariff item
• Provide technical documentation (e.g
• operator manual, specifications) to the CBSA to support classification
• Verify whether the machine qualifies for any free trade agreement preferential duty rates by confirming its origin