K&S 8800 Turbo Wafer Dicing Saw from Mexico
A high-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. It is used in semiconductor device fabrication and qualifies as a numerically controlled sawing machine.
Duty Rate — Mexico → Canada
0%
Import Tips
• Confirm the numerical control system is operational and documented
• Provide CBSA with the machine's specifications to support classification
• Check for any restrictions on used or refurbished semiconductor equipment