ESEC 2100 Wafer Sawing Platform from United States
A modular numerically controlled sawing system for semiconductor wafer cutting-off operations. It is configurable for different cermet materials and operates as a sawing machine under numerical control, fitting the tariff item for NC sawing machines.
Duty Rate — United States → Canada
0%
Import Tips
• Document the numerical control features of the platform for CBSA
• Ensure the modular configurations are listed in the import declaration
• Consult a customs broker for any additional requirements for semiconductor equipment