DISCO DFD6360 Fully Automatic Dicing Saw from Mexico
A fully automatic dicing saw with numerical control, used to saw semiconductor wafers into individual chips by removing material along scribe lines. It operates in back-end semiconductor processing and is a numerically controlled sawing machine for cutting-off cermet materials.
Duty Rate — Mexico → Canada
0%
Import Tips
• Classify the machine under 8461.50.10 as it is numerically controlled
• Provide CBSA with the machine's technical manual to confirm its sawing function
• Check if any end-use certificates are required for semiconductor manufacturing equipment