CNC Wafer Slicing Saw from Japan
The CNC Wafer Slicing Saw is a numerically controlled sawing machine designed to slice ultra-thin semiconductor wafers from monocrystalline silicon boules with precision tolerances. As an NC sawing machine for semiconductor material, it falls under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the machine is declared as numerically controlled and used for cutting-off of semiconductor wafers to match the tariff item
• Provide the CBSA with technical specifications showing the machine's NC control and slicing function
• Check if the machine qualifies for duty-free entry under the Information Technology Agreement if used in semiconductor production