Rebuilt Disco DFG Series Wafer Lapping Machine from United States
This is a refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. It falls under tariff item 8460.90.00 as a machine-tool for lapping metal (silicon) using abrasives, and is not a gear finishing machine.
Duty Rate — United States → Canada
0%
Import Tips
• Classify the machine as a rebuilt lapping machine for semiconductor wafers
• CBSA may require documentation of the refurbishment and original specifications
• Check if the machine qualifies for duty relief under the Machinery Remission Program