Numerically Controlled Wafer Lapping Machine from China
This is a CNC-controlled lapping equipment that uses abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness. It falls under tariff item 8460.90.00 as a machine-tool for lapping metal (silicon) using abrasives, and is not a gear finishing machine.
Duty Rate — China → Canada
0%
Import Tips
• Declare the machine as a lapping machine for semiconductor wafers, using abrasive slurries
• CBSA may require a detailed description of the lapping process
• Verify if the machine qualifies for duty-free treatment under certain trade agreements