Numerically Controlled CNC Wafer Grinder from China
This is a precision numerically controlled machine tool used for grinding semiconductor wafers to exact dimensional tolerances and surface flatness prior to fabrication. It falls under tariff item 8460.90.00 as a machine-tool for grinding metal (silicon) using abrasives, and is not a gear finishing machine.
Duty Rate — China → Canada
0%
Import Tips
• Classify the machine as a grinding machine for semiconductor wafers, using abrasive wheels
• CBSA may require evidence of the machine's function and specifications
• Consider whether the machine is for manufacturing semiconductors, which may affect duty rates