CNC Silicon Wafer Polishing Tool from United States
This is a numerically controlled polishing machine employing abrasive slurries to finish silicon wafer surfaces to nanometer-level flatness for semiconductor device fabrication. It falls under tariff item 8460.90.00 as a machine-tool for polishing metal (silicon) using abrasives, and is not a gear finishing machine.
Duty Rate — United States → Canada
0%
Import Tips
• Declare the machine as a CNC polishing machine for silicon wafers, using abrasive slurries
• CBSA may require evidence of the machine's function and specifications
• Verify if the machine is eligible for duty relief under the Machinery Remission Program