CNC Semiconductor Wafer Polisher from Japan
This is a precision numerically controlled polishing machine that uses abrasive pads and products to finish semiconductor wafer surfaces to a mirror quality. It falls under tariff item 8460.90.00 as a machine-tool for polishing metal (silicon) using abrasives, and is not a gear finishing machine.
Duty Rate — Japan → Canada
0%
Import Tips
• Declare the machine as a polishing machine for semiconductor wafers, using abrasive pads
• CBSA may require a detailed description of the polishing process
• Check if the machine qualifies for duty-free treatment under certain trade agreements