CNC Precision Deburring Machine for Wafer Carriers from Japan
This is a numerically controlled deburring tool that removes burrs from metal wafer carriers and semiconductor handling fixtures using abrasive methods. It falls under tariff item 8460.90.00 as a machine-tool for deburring metal using abrasives, and is not a gear finishing machine.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the machine is described as a deburring machine for metal parts, not a semiconductor manufacturing machine
• Provide CBSA with details on the abrasive method used
• Verify if the machine is eligible for duty deferral programs