Used Moore Machine Tool Nanometer Lapper from United States
A used advanced lapping machine achieving nanometer-level wafer flatness for leading-edge semiconductor production. It features active thermal control and is classified under 8460.40.10 as a numerically controlled lapping machine for metal or cermets.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• For used machinery, provide proof of the original manufacturer and the numerical control system's functionality
• Ensure the machine's age and condition are documented for CBSA assessment
• Consider duty relief options for used manufacturing equipment