Rebuilt Engis Hyprez Lapping Machine from United States
A rebuilt precision lapping system for finishing semiconductor substrates including silicon carbide wafers using electrolytic abrasives. It achieves high flatness and is classified under 8460.40.10 as a numerically controlled lapping machine for metal or cermets.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the rebuilt machine's numerical control system is documented and operational
• If the machine uses electrolytic abrasives, confirm that the abrasive materials are classified separately
• Consider applying for duty relief if the machine is used in a manufacturing process