Rebuilt Disco DFG8340 Wafer Lapping System from United States
The Rebuilt Disco DFG8340 Wafer Lapping System is a rebuilt numerically controlled lapping system for semiconductor wafers, achieving sub-micron flatness on silicon substrates using diamond abrasives. Although rebuilt, it retains its numerical control and lapping function. This machine falls under tariff item 8460.40.10 as a numerically controlled lapping machine for metal or cermets, as semiconductor wafers are considered cermet-like materials.
Duty Rate — United States → Canada
Import Tips
• For rebuilt machines, provide documentation of the rebuilding process and confirm the numerical control system is functional
• Classify the machine under 8460.40.10 if it is numerically controlled and used for lapping metal or cermets
• Ensure the machine meets Canadian import requirements for used or rebuilt equipment