Okamoto CNC Double-Sided Lapping Machine DLS-1200 from United States
A numerically controlled double-sided lapping system that finishes both surfaces of semiconductor wafers simultaneously to nanometer-level flatness. It is used after wafer slicing to meet strict dimensional tolerances, and falls under tariff item 8460.40.10 as a numerically controlled lapping machine for metal or cermets.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the machine is declared as numerically controlled and include the CNC controller model in your documentation
• Verify whether the machine qualifies for duty relief under the Machinery Remission Program if used in manufacturing
• Be prepared to provide technical specifications to the CBSA to confirm classification under 8460.40.10