Precision CNC Wafer Backside Grinder from Germany
This numerically controlled grinder thins semiconductor wafers from the backside to a target thickness (typically 50-775 microns) using diamond abrasives on metal or cermet surfaces. It is a machine-tool for finishing metal or cermets by grinding, within the scope of heading 84.60. The numerical control feature qualifies it for tariff item 8460.24.00.
Duty Rate — Germany → Canada
0%
Import Tips
• Declare the grinder as a numerically controlled machine-tool for finishing metal or cermets, and provide the CNC model and software version to the CBSA
• Ensure the machine's end-use is clearly stated; if it is solely for semiconductor manufacturing, heading 84.86 may apply instead
• Consider applying for a tariff classification ruling from the CBSA to confirm the correct item before shipping