Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules from Japan
This numerically controlled grinding machine is used to grind semiconductor crystal boules to a precise diameter and to create flats that indicate conductivity type and resistivity. It operates on metal or cermet surfaces using grinding stones or abrasives, which places it within the scope of heading 84.60 for finishing machines. The numerical control feature qualifies it for tariff item 8460.24.00.
Duty Rate — Japan → Canada
Import Tips
• Ensure the grinder is declared as a machine-tool for finishing metal or cermets, with numerical control, to match tariff item 8460.24.00
• Provide a detailed technical description and the machine's serial number to the CBSA to avoid classification delays
• Verify if the grinder qualifies for any free trade agreement (e.g
• CUSMA) to potentially reduce or eliminate duty