Numerically Controlled Czochralski Boule Grinder from Japan
An NC grinding machine specifically designed for Czochralski method silicon boules, grinding to precise diameters post-crystal pulling for semiconductor wafer production. This machine is classified under 8460.24.00 as a numerically controlled abrasive grinding machine.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Provide the CBSA with the machine's specifications and NC documentation
• Be prepared to explain the boule grinding process