NC Wafer Edge Profiling Grinder from Japan
A numerically controlled edge grinding machine that profiles semiconductor wafer edges to precise specifications, preventing chipping during handling and processing. This machine is classified under 8460.24.00 as a numerically controlled abrasive grinding machine.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Provide the CBSA with the machine's specifications and NC documentation
• Be ready to explain the edge profiling function