CNC Semiconductor Wafer Surface Lapper from Germany
A numerically controlled lapping machine that achieves ultra-flat wafer surfaces critical for semiconductor fabrication by using abrasive slurries on metal or cermet surfaces. This machine is classified under 8460.24.00 as a numerically controlled grinding machine.
Duty Rate — Germany → Canada
0%
Import Tips
• Provide the CBSA with the machine's specifications and NC documentation
• Be prepared to explain the lapping process