CNC Semiconductor Wafer Notch Grinder from Japan
A numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. This machine falls under 8460.24.00 as a numerically controlled abrasive grinding machine for semiconductor wafers.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Document the machine's specific function and NC control
• The CBSA may require technical literature to support classification