8460.23.00/Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles/Germany
Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles from Germany
A numerically controlled internal cylindrical grinder for precision grinding of internal surfaces on spindles used in semiconductor wafer processing equipment. It employs NC operations with grinding stones to achieve exacting tolerances, qualifying under tariff item 8460.23.00.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Document the machine's specific use in semiconductor manufacturing for customs
• Verify if the grinder requires any export permits from the country of origin
• Ensure compliance with Canadian safety regulations for industrial machinery