Surface Grinding Machine with Wafer Preparation Kit from Mexico
This standard flat surface grinder is equipped with a vacuum chuck and thin wafer handling fixtures for semiconductor wafer backgrinding. It is capable of general metal grinding but marketed for wafer thinning. It falls under this tariff item as a flat-surface grinding machine for metal or cermets, as it is not specifically for semiconductor manufacturing.
Duty Rate — Mexico → Canada
0%
Import Tips
• Confirm the machine is not classified under heading 84.86 for semiconductor manufacturing; it remains a flat-surface grinder
• Document the vacuum chuck and wafer handling fixtures for CBSA
• Verify if the machine's primary use is metal grinding to avoid reclassification