Wafer Slicing Saw Blade Holder from Japan
A wafer slicing saw blade holder is a durable holder mechanism for diamond blades in wafer slicing saws that cut semiconductor boules into thin wafers. It is classified under tariff item 8454.90.00 as a part of casting machines for metallurgical semiconductor processing.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the blade holder under 8454.90.00 as a part of casting machines
• Provide drawings showing its function in wafer slicing
• Verify if the holder is a part of a machine tool under another heading