Wafer Slicing Diamond Saw Blade
A high-precision diamond saw blade used in wafer slicing saws to cut monocrystalline semiconductor boules into thin wafers. It is a part of wafer slicing equipment, classified under this tariff item per the statistical notes for semiconductor wafer preparation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the blade is an interchangeable tool for a machine tool
Interchangeable tools for machine tools are classified in heading 84.66.
If the blade is a circular saw blade with steel working parts
Circular saw blades with steel working parts are classified in heading 82.02, excluded from Chapter 84 by Section Note 1(k).
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the saw blade as a part of wafer slicing machinery under 8451.90.90, not as a tool of Chapter 82
• Provide a statement of use to the CBSA to confirm the blade's role in semiconductor wafer slicing
• Verify if a preferential tariff rate applies under a free trade agreement
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