Semiconductor Wafer Lapping Plate from United States
A cast iron or ceramic lapping plate used in wafer grinders and lapping machines to achieve precise flatness and dimensional tolerances on semiconductor wafers before fabrication. It is classified under this tariff item as a part of machinery for finishing textile fabrics, per the statistical notes for semiconductor wafer preparation equipment.
Duty Rate — United States → Canada
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the lapping plate as a part of wafer preparation machinery under 8451.90.90, not as a machine tool part
• Keep documentation showing the plate is used solely for semiconductor wafer lapping to support the classification
• Check if the MFN duty rate or a preferential rate under a trade agreement applies to your shipment