Semiconductor Wafer Edge Grinder Wheel from United States
A diamond-impregnated edge grinding wheel used to bevel and round the edges of semiconductor wafers after slicing, preventing chipping during handling and processing. It is a part of wafer grinding equipment, classified under this tariff item as parts of machinery for cleaning or finishing textile yarns or fabrics, per the statistical notes for semiconductor wafer preparation equipment.
Duty Rate — United States → Canada
Import Tips
• Ensure the wheel is declared as a part of wafer preparation machinery, not as a tool of Chapter 82, to avoid misclassification
• Provide a detailed product description and end-use statement to the CBSA to support the classification under 8451.90.90
• Verify whether the Most-Favoured-Nation (MFN) duty rate applies or if a preferential tariff under a free trade agreement is available