Used Wafer Slicing Diamond Saw from United States
This is a used diamond wire saw used for slicing thin wafers from monocrystalline semiconductor boules. It is classified under tariff item 8439.10.00 as machinery for making pulp of fibrous cellulosic material, per the statistical note indicating wafer slicing saws fall under this item.
Duty Rate — United States → Canada
0%
Import Tips
• Provide proof that the saw is used and describe its specific function in wafer slicing to support classification
• Be prepared for potential CBSA scrutiny regarding the unusual classification of semiconductor equipment under pulp machinery
• Ensure all safety and environmental regulations for used machinery are met